The SBD-embedded SiC-MOSFET and optimized package structure are said to reduce switching loss by 91% compared with the firm’s existing silicon power module and by 66% compared with the existing SiC power module, reducing inverter power loss and contributing to higher output and efficiency. Picture: Mitsubishi Electric’s new 3.3kV SBD-embedded SiC MOSFET module. Measuring 100mm x 140mm x 40mm, the new module FMF800DC-66BEW is expected to support superior power output, efficiency and reliability in inverter systems for large industrial equipment such as railways and electric power systems.
Mitsubishi Electric to ship samples of 3.3kV SBD-embedded SiC MOSFET moduleĪfter already releasing four full-SiC modules and two 3.3kV high-voltage dual-type LV100 modules, Tokyo-based Mitsubishi Electric Corp says that on 31 May it will begin shipping samples of a new Schottky barrier diode (SBD)-embedded silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) module, featuring dual-type 3.3kV withstand voltage and 6.0kV rms isolation voltage (dielectric strength).
0 kommentar(er)
